User:Tauwasser/Sandbox/Game Boy Cartridges
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Revision as of 13:04, 13 January 2013 by Tauwasser (Talk | contribs) (Preliminary version of a PCB description guide)
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DMG PCB Naming Convention
DMG PCB codes follow the following convention:
DMG[-?[?]]-???[?][(?)]-NN | | | \-- PCB revision | | \------- optional code in parentheses | \-------------- mandatory three or four-letter descriptor \--------------------- one or two-letter optional part
Descriptor Codes
Code | MBC/Battery | ROM Size | RAM Size | ROM Package |
---|---|---|---|---|
(none) | - | - | - | QFP |
A | none | 256kbit | none | - |
B | MBC1A/MBC1B/MBC1B1 | 512kbit? | -? | - |
C | - | 1Mbit | 64kbit | Chip-on-Board |
D | MBC1A/MBC1B/MBC1B1 + CR1616 | 2Mbit? | 256kbit | - |
E | - | 4Mbit | 512kbit | - |
F | - | 8Mbit | - | - |
G | MBC2A + CR1616 | 16Mbit | - | - |
H | - | 32Mbit | - | - |
K | MBC3A/MBC3B + CR2025 | - | - | - |
M | MBC30 + CR2025 | - | - | - |
N | - | - | - | SOIC (narrow) |
P | MMM01 | - | - | - |
S | MMM01 + CR1616 | - | - | - |
T | HuC1A + CR1616 | - | - | TSSOP |
U | HuC3A + CR2025 | - | - | TSOP |
For example, DMG-BEAN-02 is a PCB made for
- MBC1A/MBC1B/MBC1B1 (without battery)
- 256kbit of ROM
- no SRAM
- ROM chip package is a narrow SOIC
PCB Revisions
Numbers include
- 01
- 02
- 03
- 10
Mostly minor routing differences if any. Sometimes additional components in 10. Never additional components in 0x?
Optional Parts
DMG-MC-SFCN-01 Momotarou Collection 2 DMG-M-PEAN-10 Taito Variety Pack
MC = Momotarou Collection? MultiCart?
Code in parentheses after descriptor is only ever K.
DMG-BEAN(K)-10 Xenon 2 DMG-DECN(K)-02 Mogurania (Mole Mania)
CGB PCB Naming Convention
CGB PCB codes follow the following convention:
DMG-?NN-NN ||| \-- PCB revision ||\----- PCB descriptor MBC |\------ PCB descriptor RAM/ROM size combination \------- PCB code
PCB Code
- A: Production Cartridges
- B: Test Cartridges
- Z: Revisions of certain A?? variants. Sometimes routing changes.
PCB Descriptor
Descriptors describe MBC and ROM/RAM size combinations only.
Number | MBC | RAM/ROM size combination | |
---|---|---|---|
RAM sizes | ROM sizes | ||
0 | MBC5 (w/ or w/o rumble) | 4/8M | 2/4k EEPROM or 1M SRAM |
1 | MBC5 (w/ rumble) | 16/32/64M | 64k |
2 | G-MMC1 (+ 8M FLASH) | 2/4/8M | 256k |
3 | MBC6 (+ 8M FLASH) | 16/32/64M | 256k |
4 | MBC7 | 4/8M | -? |
5 | - | -? | -? |
6 | - | 2/4/8M | 64k |
7 | - | 16/32M | 2/4k EEPROM |
8 | - | -? | -? |
9 | - | -? | -? |
Maybe actually hierarchy? I.e. second figure is sub-index in first figure MBC PCB designs?
PCB Revisions
Numbers include
- 01
- 10
Never observed any major differences. Maybe minor solder mask differences?